3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics, 64)
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Condition: USED (All books are in used condition)
Condition - Very Good The item shows wear from consistent use, but it remains in good condition and functions properly. Item may arrive with damaged packaging or be repackaged. It may be marked, have identifying markings on it, or have minor cosmetic damage. It may also be missing some parts/accessories or bundled items.
3D Microelectronic Packaging: From Architectures to Applications (Springer Series in Advanced Microelectronics, 64)
