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Integrated

Through-Silicon Vias for 3D Integration
McGraw-Hill Education
Through-Silicon Vias for 3D Integration
Out of Stock
Introducing Technology Computer-Aided Design (TCAD): Fundamentals, Simulations, and Applications
Taylor & Francis
Introducing Technology Computer-Aided Design (TCAD): Fundamentals, Simulations, and Applications
R 6,337
A Guide to Noise in Microwave Circuits: Devices, Circuits and Measurement
Wiley-IEEE Press
A Guide to Noise in Microwave Circuits: Devices, Circuits and Measurement
R 5,932
Bebop to the Boolean Boogie: An Unconventional Guide to Electronics
Newnes
Bebop to the Boolean Boogie: An Unconventional Guide to Electronics
R 2,477
Digital Systems Design, Volume II: Developmental Methods and Combinational Logic Circuits
Momentum Press
Digital Systems Design, Volume II: Developmental Methods and Combinational Logic Circuits
R 2,021
Electronics for Scientists
CRC Press
Electronics for Scientists
R 2,275
Battery Management Systems: Physics-Based Methods (3)
Artech House
Battery Management Systems: Physics-Based Methods (3)
R 5,707
Advanced VLSI Design and Testability Issues
CRC Press
Advanced VLSI Design and Testability Issues
R 3,010
Switching Power Supply Design, 3rd Ed.
McGraw-Hill Education
Switching Power Supply Design, 3rd Ed.
R 4,628
Digital Systems Design, Volume III: Latch-Flip-Flop Circuits and Characteristics of Digital Circuits
Momentum Press
Digital Systems Design, Volume III: Latch-Flip-Flop Circuits and Characteristics of Digital Circuits
R 2,053
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