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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)

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Condition - Very Good
The item shows wear from consistent use, but it remains in good condition and functions properly. Item may arrive with damaged packaging or be repackaged. It may be marked, have identifying markings on it, or have minor cosmetic damage. It may also be missing some parts/accessories or bundled items.

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package (IEEE Press)
Country USA
Brand Wiley-IEEE Press
Manufacturer Wiley-IEEE Press
Binding Hardcover
ReleaseDate 2021-12-07
UnitCount 1
EANs 9781119793779

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Country	USA
Brand	Wiley-IEEE Press
Manufacturer	Wiley-IEEE Press
Binding	Hardcover
ReleaseDate	2021-12-07
UnitCount	1
EANs	9781119793779