Fundamentals of Microsystems Packaging
Product Description
Condition - Very Good
The item shows wear from consistent use but remains in good condition. It may arrive with damaged packaging or be repackaged.
Fundamentals of Microsystems Packaging
Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find:
*Full coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies―wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing
Technical Specifications
You might also like
Microelectronics Packaging Handbook: Technology Drivers Part I (Pt. 1)
Machine Elements in Mechanical Design (6th Edition) (What's New in Trades & Technology)
Air Conditioning Principles and Systems: An Energy Approach (4th Edition)
System on Package: Miniaturization of the Entire System
The Electronic Packaging Handbook (Electronics Handbook Series)
Electronic Packaging: Design, Materials, Process, and Reliability
Fabrication Engineering at the Micro- and Nanoscale (The Oxford Series in Electrical and Computer Engineering)
Mechanical Behavior of Materials