Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Product ID: 120857423 Condition: USED (All books in used condition)

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Condition: USED (All books in used condition)

Product Description

Condition - Very Good

The item shows wear from consistent use but remains in good condition. It may arrive with damaged packaging or be repackaged.

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Country

USA

Brand

McGraw-Hill Education

Manufacturer

McGraw-Hill Professional

Binding

Hardcover

EANs

9780070366480

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